|
Volumn 69, Issue 5, 2001, Pages 319-323
|
Electrodeposition of Sn-Cu alloy from pyrophosphate bath
a a a a |
Author keywords
Electrodeposited Sn Cu Alloy; Formaldehyde; Pb free; Polyethylene glycol
|
Indexed keywords
CURRENT DENSITY;
ELECTROPLATING;
EUTECTICS;
FORMALDEHYDE;
MOLECULAR WEIGHT;
MORPHOLOGY;
POLYETHYLENE GLYCOLS;
SOLDERING;
SURFACE TREATMENT;
PYROPHOSPHATE BATH;
TIN ALLOYS;
|
EID: 0035330204
PISSN: 13443542
EISSN: None
Source Type: Journal
DOI: 10.5796/electrochemistry.69.319 Document Type: Article |
Times cited : (19)
|
References (16)
|