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Volumn 69, Issue 5, 2001, Pages 319-323

Electrodeposition of Sn-Cu alloy from pyrophosphate bath

Author keywords

Electrodeposited Sn Cu Alloy; Formaldehyde; Pb free; Polyethylene glycol

Indexed keywords

CURRENT DENSITY; ELECTROPLATING; EUTECTICS; FORMALDEHYDE; MOLECULAR WEIGHT; MORPHOLOGY; POLYETHYLENE GLYCOLS; SOLDERING; SURFACE TREATMENT;

EID: 0035330204     PISSN: 13443542     EISSN: None     Source Type: Journal    
DOI: 10.5796/electrochemistry.69.319     Document Type: Article
Times cited : (19)

References (16)
  • 14
    • 0004721959 scopus 로고
    • Denkimekkikenkyuukai, Nikkan Kogyo Shinbunsha, Tokyo (in Japanese)
    • (1995) Mekki-kyohon , pp. 71


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.