A new method to predict delamination in electronic packages

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 145-150

  Fan, H B ^a   Wong, Cell K Y ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER; DELAMINATION; SOLDERING; STRESSES; SUBSTRATES; TENSILE STRESS; THERMAL EXPANSION;

BUTTON SHEAR TEST (BST); ELECTRONIC PACKAGE DESIGN; INTERFACIAL DELAMINATION; INTERFACIAL STRESSES;

ELECTRONICS PACKAGING;

EID: 24644463370     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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