Characterization of oxidized copper leadframes and copper/epoxy molding compound interface adhesion in plastic package

Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998

Volumn 1998-September, Issue , 1998, Pages 106-111

  Kang, Teck Gyu ^a   Park, Ik Seong ^a   Kim, Jong Heon ^a   Choi, Kwang Seong ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALLOYING; BINARY ALLOYS; BOND STRENGTH (MATERIALS); CHROMIUM ALLOYS; COPPER OXIDES; COST EFFECTIVENESS; ELECTROMAGNETIC COMPATIBILITY; JOINING; MOLDING; NICKEL ALLOYS; OXIDATION; PLASTIC COATINGS; SHEET MOLDING COMPOUNDS; SILICON ALLOYS; SURFACE MOUNT TECHNOLOGY; ZIRCONIUM ALLOYS;

ALLOY COMPOSITIONS; ELECTRICAL PERFORMANCE; EPOXY MOLDING COMPOUNDS; INTERFACE ADHESION; OXIDATION CONDITIONS; OXIDE LAYER THICKNESS; SEGREGATION EFFECTS; SURFACE MOUNTING;

COPPER ALLOYS;

EID: 84954199865     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ADHES.1998.742011     Document Type: Conference Paper

References (12)

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