Interfacial-energy-controlled deposition technique of microstructures using blade-coating

Journal of Physical Chemistry B

Volumn 113, Issue 46, 2009, Pages 15278-15283

  Arase, Hidekazu ^a   Nakagawa, Tohru ^a  

^a PANASONIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; DEPOSITION; DISPERSIONS; HEXANE; HYDROPHILICITY; INTERFACIAL ENERGY; MICROSTRUCTURE; MONOLAYERS; PROBABILITY; SELF ASSEMBLY; SILICON COMPOUNDS; SOLVENTS;

CAPILLARY FORCE; CHEMICALLY MODIFIED; COATING PROCESS; CONTROLLED DEPOSITION; DEPOSITION TECHNIQUE; ELECTRONIC DEVICE; FLUIDIC SELF-ASSEMBLY; FREE ENERGY CHANGE; N-HEXANE;

SUBSTRATES;

EID: 70449553478     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp9070289     Document Type: Article

References (28)

1. Morris, C. J.; Stauth, S. A.; Parviz, B. A. IEEE Trans. Adv. Packag. 2005, 28, 600.
2. Cohn, M. B.; Böhringer, K. F.; Noworolski, J. M.; Singh, A.; Keller, C. G.; Goldberg, K. Y.; Howe, R. T. Microassembly Technologies for MEMS. Proceedings of SPIE Micromachining and Microfabrication, Conference on Micromachining and Microfabrication Process Technology IV, Santa Clara, CA, Sept 21-22, 1998; pp 2-16.
3. Stauth, S. A.; Parviz, B. A. Proc. Natl. Acad. Sci., U.S.A. 2006, 103, 13922.
4. Lee, K. J.; Lee, J; Hwang, H; Reitmeier, Z. J; Davis, R. F; Rogers, J. A.; Nuzzo, R. G. Small 2005, 1, 1164.
5. Lee, K. J.; Meitl, M. A.; Ahn, J.; Rogers, J. A.; Nuzzo, R. G.; Kumar, V.; Adesida, I. J. Appl. Phys. 2006, 100, 124507.
6. Yeh, H.-J. J.; Smith, J. S. IEEE Photonics Technol. Lett. 1994, 6, 105.
7. Terfort, A.; Bowden, N.; Whitesides, G. M. Nature 1997, 386, 162.
8. Tien, J.; Breen, T. L.; Whitesides, G. M. J. Am. Chem. Soc. 1998, 120, 12670.
9. Breen, T. L.; Tien, J.; Oliver, S. R. J.; Hadzic, T.; Whitesides, G. M. Science 1999, 284, 948.
10. Jacobs, H. O.; Tao, A, R.; Schwartz, A.; Gracias, D. H.; Whitesides, G. M. Science 2002, 296, 323.
11. Terfort, A.; Whitesides, G. M. Adv. Mater. 1998, 10, 470.
12. Bowden, N.; Oliver, S. R. J.; Whitesides, G. M. J. Phys. Chem. B 2000, 104, 2714.
13. Syms, R. R. A.; Yeatman, E. M.; Bright, V. M.; Whitesides, G. M. J. Microelectromech. Syst. 2003, 12, 287.
14. Srinivasan, U.; Liepmann, D.; Howe, R. T. J. Microelectromech. Syst. 2001, 10, 17.
15. Xiong, X.; Hanein, Y.; Fang, J.; Wang, Y.; Wang, W.; Schwarz, D. T.; Böhringer, K. F. J. Microelectromech. Syst. 2003, 12, 117.
16. Schott, K. L.; Hirano, T.; Yang, H.; Singh, H.; Howe, R. T.; Niknejad, A. M. J. Microelectromech. Syst. 2004, 13, 300.
17. Onoe, H.; Matsumoto, K.; Shimoyama, I. J. Microelectromech. Syst. 2004, 13, 603.
18. Murakami, Y.; Idegami, K.; Nagai, H.; Yamamura, A.; Yokoyama, K.; Tamiya, E. Proceedings of IEEE Workshop on Micro Electro Mechanical Systems (MEMS), Switzerland, 2001, pp 369-374.
19. Nakakubo, T.; Shimoyama, I. Sens. Actuators 2000, A83, 161.
20. Soga, I.; Ohno, Y.; Kishimoto, S.; Maezawa, K.; Mizutani, T. Jpn. J. Appl. Phys. 2003, 42, 2226.
21. Zheng, W.; Jacobs, H. O. Adv. Mater. 2006, 18, 1387.
22. Zheng, W.; Buhlman, P.; Jacobs, H. O. Proe Natl. Acad. Sci. U.S.A. 2004, 101, 12814.
23. Sharma, R. Langmuir 2007, 23, 6843.
24. Nakagawa, T.; Torii, H.; Kawashima, T.; Saitoh, T. J. Phys. Chem. C 2008, 112, 5390.
25. Van Oss, C. J.; Chaudhury, M. K.; Good, R. J. Chem. Rev. 1988, 88, 927.
26. Van Oss, C. J.; Good, R. J.; Chaudhury, M. K. Langmuir 1988, 4, 884.
27. Good, R. J. Contact angle, wetting, and adhesion: A critical review. In Contact Angle, Wettability and Adhesion; Mittal, K. L., Ed.; 1993; vol.VSP BV; pp 3-36.
28. 2 plate in the dispersion by a height 0.2 mm, which is a distance between the substrate and the blade edge faced the substrate.