Fast full wave analysis of PCB via arrays with model-to-hardware correlation

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Volumn , Issue , 2009, Pages 175-178

  Gu, Xiaoxiong ^a   Wu, Boping ^b   Baks, Christian ^a   Tsang, Leung ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF WASHINGTON   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FOUR-ORDER; FULL WAVE ANALYSIS; FULL WAVES; MULTI-LAYERED PRINTED CIRCUIT BOARDS;

ELECTRONICS PACKAGING; PRINTED CIRCUIT MANUFACTURE; THREE DIMENSIONAL;

PRINTED CIRCUIT BOARDS;

EID: 74549130068     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2009.5338448     Document Type: Conference Paper

References (7)

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