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Volumn 66, Issue 1-3, 1998, Pages 160-166

Low-pressure-encapsulated resonant structures with integrated electrodes for electrostatic excitation and capacitive detection

Author keywords

Capacitive detection; Electrostatic excitation; Lateral electrical feedthrough; Low pressure encapsulation; Q factor

Indexed keywords

ELECTRODES; MICROMACHINING; Q FACTOR MEASUREMENT; SILICON WAFERS; SUBSTRATES;

EID: 0032049404     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(98)80019-8     Document Type: Article
Times cited : (34)

References (17)
  • 1
    • 0026170681 scopus 로고
    • Resonant silicon sensors
    • G. Stemme, Resonant silicon sensors, J. Micromech. Microeng. 1 (1991) 113-125.
    • (1991) J. Micromech. Microeng. , vol.1 , pp. 113-125
    • Stemme, G.1
  • 4
    • 0024070543 scopus 로고
    • Silicon resonator sensors: Interrogation techniques and characteristics
    • M.J. Tudor, M.V. Andres, K.W.H. Foulds, J.M. Naden, Silicon resonator sensors: interrogation techniques and characteristics, IEE Proc. 135 (1988) 364-368.
    • (1988) IEE Proc. , vol.135 , pp. 364-368
    • Tudor, M.J.1    Andres, M.V.2    Foulds, K.W.H.3    Naden, J.M.4
  • 5
    • 0028529046 scopus 로고
    • Electrostatically driven vacuum-encapsulated polysilicon resonators. Part II. Theory and performance
    • H.A.C. Tilmans, R. Legtenberg, Electrostatically driven vacuum-encapsulated polysilicon resonators. Part II. Theory and performance, Sensors and Actuators A 45 (1994) 67-84.
    • (1994) Sensors and Actuators A , vol.45 , pp. 67-84
    • Tilmans, H.A.C.1    Legtenberg, R.2
  • 6
    • 0028426115 scopus 로고
    • Vacuum packaging for microsensors by glass-silicon anodic bonding
    • H. Henmi, S. Shoji, K. Yoshimi, M. Esashi, Vacuum packaging for microsensors by glass-silicon anodic bonding, Sensors and Actuators A 43 (1994) 243-248.
    • (1994) Sensors and Actuators A , vol.43 , pp. 243-248
    • Henmi, H.1    Shoji, S.2    Yoshimi, K.3    Esashi, M.4
  • 7
    • 84949083794 scopus 로고
    • A high sensitivity integrated circuit capacitive pressure transducer
    • W.H. Ko, M.H. Bao, Y.D. Hong, A high sensitivity integrated circuit capacitive pressure transducer, IEEE Trans. Electron Devices ED-29 (1982) 48.
    • (1982) IEEE Trans. Electron Devices , vol.ED-29 , pp. 48
    • Ko, W.H.1    Bao, M.H.2    Hong, Y.D.3
  • 8
    • 0028407817 scopus 로고
    • Extremely miniaturized capacitive movement sensors using new suspension systems
    • R. Puers, D. Lapadatu, Extremely miniaturized capacitive movement sensors using new suspension systems, Sensors and Actuators A 41-42 (1994) 129-135.
    • (1994) Sensors and Actuators A , vol.41-42 , pp. 129-135
    • Puers, R.1    Lapadatu, D.2
  • 11
    • 0029272646 scopus 로고
    • Fluid density sensor based on resonance vibration
    • P. Enoksson, G. Stemme, E. Stemme, Fluid density sensor based on resonance vibration, Sensors and Actuators A 46-47 (1995) 327-331.
    • (1995) Sensors and Actuators A , vol.46-47 , pp. 327-331
    • Enoksson, P.1    Stemme, G.2    Stemme, E.3
  • 12
    • 0031163307 scopus 로고    scopus 로고
    • A silicon resonant structure for Coriolis mass-flow measurements
    • P. Enoksson, G. Stemme, E. Stemme, A silicon resonant structure for Coriolis mass-flow measurements, J. Microelectromech. Syst. 6 (1997) 119-125.
    • (1997) J. Microelectromech. Syst. , vol.6 , pp. 119-125
    • Enoksson, P.1    Stemme, G.2    Stemme, E.3
  • 13
    • 0030107581 scopus 로고    scopus 로고
    • Vibration modes of a resonant silicon tube density sensor
    • P. Enoksson, G. Stemme, E. Stemme, Vibration modes of a resonant silicon tube density sensor, J. Microelectromech, Syst. 5 (1996) 39-44.
    • (1996) J. Microelectromech, Syst. , vol.5 , pp. 39-44
    • Enoksson, P.1    Stemme, G.2    Stemme, E.3
  • 14
    • 0031169981 scopus 로고    scopus 로고
    • Gas damping of electrostatically excited resonators
    • T. Corman, P. Enoksson, G. Stemme, Gas damping of electrostatically excited resonators, Sensors and Actuators A 61 (1997) 249-255.
    • (1997) Sensors and Actuators A , vol.61 , pp. 249-255
    • Corman, T.1    Enoksson, P.2    Stemme, G.3
  • 15
    • 0022238888 scopus 로고
    • Bonding techniques for microsensors
    • C.D. Fung, P.W. Chueng, W.H. Ko, D.G. Fleming (Eds.), Elsevier Science, Amsterdam
    • W.H. Ko, J.T. Sumito, G.J. Yeh, Bonding techniques for microsensors, in: C.D. Fung, P.W. Chueng, W.H. Ko, D.G. Fleming (Eds.), Micro-machining and Micropackaging of Transducers, Elsevier Science, Amsterdam, 1985, pp. 41-61.
    • (1985) Micro-machining and Micropackaging of Transducers , pp. 41-61
    • Ko, W.H.1    Sumito, J.T.2    Yeh, G.J.3
  • 16
    • 0026156470 scopus 로고
    • Capacitive polysilicon resonator with MOS detection circuit
    • C. Linder, E. Zimmermann, N.F. de Rooij, Capacitive polysilicon resonator with MOS detection circuit, Sensors and Actuators A 25-27 (1991) 591-595.
    • (1991) Sensors and Actuators A , vol.25-27 , pp. 591-595
    • Linder, C.1    Zimmermann, E.2    De Rooij, N.F.3
  • 17
    • 0000618993 scopus 로고
    • Electronic transducers for industrial measurement of low value capacitances
    • S.M. Huang, A.L. Stott, R.G. Green, M.S. Beck, Electronic transducers for industrial measurement of low value capacitances, J. Phys. E: Sci. Instrum. 21 (1988) 242-250.
    • (1988) J. Phys. E: Sci. Instrum. , vol.21 , pp. 242-250
    • Huang, S.M.1    Stott, A.L.2    Green, R.G.3    Beck, M.S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.