Microgrinding of flat surfaces on single-disc lapping machine

International Journal of Machining and Machinability of Materials

Volumn 5, Issue 2-3, 2009, Pages 245-267

  Barylski, Adam ^a   Deja, Mariusz ^a  

^a GDANSK UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

Lapping kinematics; Machining marks; Microgrinding; Simulation

Indexed keywords

LAPPING MACHINES;

DIAMOND GRAINS; FLAT SURFACES; GRIT SIZE; MACHINING MARKS; MICRO-GRINDING; SIMULATION;

LAPPING;

EID: 70349733154     PISSN: 17485711     EISSN: 1748572X     Source Type: Journal    
DOI: 10.1504/IJMMM.2009.023393     Document Type: Article

References (24)

1. Ardelt, Th. (2001) 'Verfahrensvergleich planschleifen mit planetenkinematik-planparallelläppen', Industrie Diamanten Rundschau IDR, Vol. 35, No. 3, pp.214-224.
2. Barylski, A. (1999) 'Investigation methods of surface contamination', Abrasives Mag., February/March, pp.14-15.
3. Barylski, A. and Deja, M. (1998) 'Computer aided quality control of plane lapping', J. Balkan Tribological Assoc., Vol. 4, No. 1, pp.1-7.
4. Barylski, A., Deja, M. and Stolarski, T. (1997) 'Computer simulation of kinematic systems of lapping machines', Surface Treatment III, Transactions of the Wessex Institute: Engineering Sciences, Vol. 17, pp.409-417.
5. Beyer, P. and van Ravenzwaaij, M. (2005) 'Innovative flat honing with vitrified-bond grinding and conditioning tools', Industrial Diamond Review, Vol. 4, pp.47-50.
6. Engel, H., Ardelt, Th., Barylski, A. and Feld, M. (1999) 'Verfahrensvergleich läppen-läppschleifen', Werkstattstechnik Vol. 89, No. 3, pp.228-230.
7. Engel, Z. and Giergiel, J. (1990) 'Mechanics - statics and kinematics', PWN, Warszawa 1990, in Polish, pp.191-192.
8. Hwang, T.W., Evans, C.J. and Malkin, S. (2000a) 'High speed grinding of silicon nitride with electroplated diamond wheels, part 2: Wheel topography and grinding mechanisms', J. Manufacturing Science and Engineering, Vol. 122, No. 1, pp.42-50
9. Hwang, T.W., Evans, C.J., Whitenton, E.P. and Malkin, S. (2000b) 'High speed grinding of silicon nitride with electroplated diamond wheels, part 1: Wear and wheel life', J. Manufacturing Science and Engineering, Vol. 122, No. 1, pp.32-41.
10. Itoh, N., Ohmori, H., Moriyasu, S., Kasai, T., Karaki-Doy, T. and Bandyopadhyay, B.P. (1998) 'Finishing characteristics of brittle materials by ELID-lap grinding using metal-resin bonded wheel', Int. J. Machine Tools and Manufacture, Vol. 38, No. 7, pp.747-762.
11. Jackson, M.J. (2006) 'Abrasive layer fracture wear of microgrinding tools', Int. J. Nanomanufacturing, Vol. 1, No. 1, pp.134-149.
12. Jackson, M.J. and Ahmed, W. (2005) 'Characterization of N-doped polycrystalline diamond films deposited on microgrinding tools', J. Materials Engineering and Performance, Vol. 14, No. 5, pp.654-664.
13. Jackson, M.J., Robinson, G.M., Khangar, A., Kenik, E.A. and Dahotre, N.B. (2006) 'Microgrinding hypereutectoid steels using laser-modified corundum abrasive materials', Int. J. Machining and Machinability of Materials, Vol. 1, No. 1, pp.12-26.
14. Leitner, R. (1995) 'Mathematics - part I', WNT, Warszawa 1995, in Polish.
15. Li, Z.C., Pei, Z.J. and Fisher, G.R. (2006) 'Simultaneous double side grinding of silicon wafers: A literature review', Int. J. Machine Tools and Manufacture, Vol. 46, Nos. 12-13, pp.1449-1458.
16. Liu, J.H., Pei, Z.J. and Fisher, G.R. (2007) 'ELID grinding of silicon wafers: A literature review', Int. J. Machine Tools and Manufacture Vol. 47, Nos. 3-4, pp.529-536.
17. Shi, Z. and Malkin, S. (2003) 'An investigation of grinding with electroplated CBN wheels', Annals of the CIRP, Vol. 52, No. 1, pp.267-270.
18. Shi, Z. and Malkin, S. (2006) 'Wear of electroplated CBN wheels', ASME J. Manufacturing Science and Engineering, Vol. 128, pp.110-118.
19. Uhlmann, E. and Ardelt, Th. (1999) 'Influence of kinematics on the face grinding process on lapping machines', Annals of the CIRP, Manufacturing Technology, Vol. 48, No. 1, pp.281-284.
20. Uhlmann, E., Ardelt, Th. and Daus, N. (1998) 'Kinematische analyse von zweischeibenmaschinen', Werkstattstechnik, Vol. 88, No. 6, pp.273-276.
21. Wangping, S., Pei, Z.J. and Fisher, G.R. (2004) 'Fine grinding of silicon wafers: A mathematical model for the wafer shape', Int. J. Machine Tools and Manufacture, Vol. 44, Nos. 7-8, pp.707-716.
22. Wendt, U., Stiebe-Lange, K. and Smid, M. (2002) 'On the influence of imaging conditions and algorithms on the quantification of surface topography', J. Microscopy, Vol. 207, pp.169-179.
23. Xin, X.J., Pei, Z.J. and Liu, W. (2004) 'Finite element analysis on soft-pad grinding of wire-sawn silicon wafers', J. Electronic Packaging, Vol. 126, No. 2, pp.177-185.
24. Zhang, B., Liu, X., Brown, C.A. and Bergstrom, T.S. (2002) 'Microgrinding of nanostructured material coatings', CIRP Ann. Manufacturing Technology, Vol. 51, No. 1, pp.251-254.