Packaging and assembly of 3-D silicon stacked module for image sensor application

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 3, 2008, Pages 519-526

  Yoon, Seung Wook ^a   Ganesh, V P ^a   Lim, Samuel Yak Long ^a   Kripesh, Vaidyanathan ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Stacked module; Three dimensional packaging; Three dimensional system in package (SiP); Through silicon via (TSV)

Indexed keywords

ASSEMBLY TECHNOLOGIES; FLIP CHIPS; PROCESS DEVELOPMENT; SENSOR APPLICATIONS; SILICON CARRIERS; STACKED MODULE; THIN FILM METALLIZATION; THREE-DIMENSIONAL PACKAGING; THREE-DIMENSIONAL SYSTEM-IN-PACKAGE (SIP); THROUGH SILICON VIA (TSV); WAFER THINNING; WIRE BONDINGS; WIRE BONDS;

CELLULAR RADIO SYSTEMS; CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; GLASS; GLASS BONDING; INTERNET PROTOCOLS; NONMETALS; SILICON WAFERS; SYSTEMS ANALYSIS; THREE DIMENSIONAL; WAFER BONDING; WIRE;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 65349177340     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.927826     Document Type: Article

References (11)

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