Atmospheric pressure plasma cleaning of gold flip chip bump for ultrasonic flip chip bonding

Journal of Physics: Conference Series

Volumn 100, Issue 1, 2008, Pages

  Koo, J M ^a   Lee, J B ^a   Moon, Y J ^b   Moon, W C ^a   Jung, S B ^a  

^a Sungkyunkwan University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC PRESSURE; BONDING; CLEANING; GOLD; NANOSCIENCE;

ATMOSPHERIC PRESSURE PLASMAS; DIRECT BONDING; FLIP CHIP BONDING; FLIP CHIP BUMPS; JOINT STRENGTH; PLASMA CLEANING; PROCESSING TIME; SURFACE OXIDATIONS;

FLIP CHIP DEVICES;

EID: 44649197271     PISSN: 17426588     EISSN: 17426596     Source Type: Conference Proceeding    
DOI: 10.1088/1742-6596/100/1/012034     Document Type: Article

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