Improvements in Au wire bondability of rigid and flexible substrates using plasma cleaning

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 366-371

  Chan, Yu Hin ^a   Kim, Jang Kyo ^a   Liu, Deming ^b   Liu, Peter Chou Kee ^b   Cheung, Yiu Ming ^b   Ng, Ming Wai ^b  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^b ASM Assembly Automation Ltd   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; INPUT OUTPUT PROGRAMS; WIRE;

INTERCONNECTION TECHNOLOGY; PLASMA CLEANING; SUBSTRATE MATERIALS; WEDGE BONDS;

GOLD METALLURGY;

EID: 33846279756     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564609     Document Type: Conference Paper

References (9)

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