An electro-fluidic assembly technique for integration of III-V devices onto silicon

IEEE International Symposium on Compound Semiconductors, Proceedings

Volumn , Issue , 2000, Pages 137-142

  Nordquist, C D ^a   Smith, P A ^a   Mayer, T S ^a  

^a The Pennsylvania State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRIC FIELDS; SEMICONDUCTING SILICON; SUBSTRATES;

ELECTRO-FLUIDIC ASSEMBLY TECHNIQUE; HETEROGENEOUS INTEGRATED CIRCUITS;

SEMICONDUCTOR DEVICES;

EID: 0034424742     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)