"glassPack" - Photonic packaging using thin glass foils for electrical-optical circuit boards (EOCB) and sensor modules

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Volumn , Issue , 2008, Pages 1245-1250

  Schroder, Henning ^a   Amdt Staufenbiel, Norbert ^a   Brusberg, Lars ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS; SENSORS;

ELECTRICALOPTICAL CIRCUIT BOARDS; OPTICAL BACKPLANE; OPTICAL CIRCUIT BOARDS; OPTOELECTRONIC APPLICATIONS; PACKAGING TECHNOLOGIES; PHOTONIC PACKAGING; SENSOR MODULES; WIDE AREAS;

OPTICAL SENSORS;

EID: 58149085560     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2008.4684532     Document Type: Conference Paper

References (10)

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3. Najafi, S. I., "Introduction to glass integrated optics," Artech House (Boston, London, 1992)
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9. Elshabini-Riad, A.; Barlow, F. D.: "Thin film technology: handbook". McGraw-Hill, New York, USA (1997).
10. Du, K. and Shi, P., "Surface precision machining of glass substrates by innovative lasers," Glass Science Technology, Vol. 76, No. 2 (2003).