Use of elastic conductive adhesive as the bonding agent for the fabrication of vertical structure GaN-based LEDs on flexible metal substrate

IEEE Photonics Technology Letters

Volumn 20, Issue 7, 2008, Pages 523-525

  Kuo, Hon Yi ^a   Wang, Shui Jinn ^a   Wang, Pei Ren ^a   Uang, Kai Ming ^b   Chen, Tron Min ^b   Chen, Shiue Lung ^a   Lee, Wei Chi ^a   Hsu, Hong Kuei ^a   Chou, Jui Chiang ^a   Wu, Chung Han ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b WUFENG INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Bonding; Flexible; GaN; Laser lift off (LLO); Light output power; Light emitting diodes (LEDs); Strain; Substrate

Indexed keywords

BENDING STRESS; BONDING AGENT; CHIP SIZES; CONDUCTIVE ADHESIVE; DOMINANT WAVELENGTH; EXTERNAL STRESS; FORWARD VOLTAGE; GAN BASED LED; GAN-BASED LIGHT-EMITTING DIODES; LASER LIFT-OFF; LASER LIFT-OFF (LLO); LASER LIFT-OFF TECHNOLOGIES; LIGHT OUTPUT; LIGHT OUTPUT POWER; LIGHT-EMITTING DIODES (LEDS); METAL SUBSTRATE; SAPPHIRE SUBSTRATES; VERTICAL STRUCTURES; FLEXIBLE; GAN;

CURRENT VOLTAGE CHARACTERISTICS; DIODES; GALLIUM NITRIDE; LIGHT EMISSION; LIGHT EMITTING DIODES; SUBSTRATES;

GALLIUM ALLOYS;

EID: 70349669837     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2008.918880     Document Type: Article

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