Comparison of joint level impact fatigue resistance and board level drop test

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1708-1713

  Guruprasad, Pradosh ^a   Pitarres, James ^a  

^a State University of New York   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOARD LEVEL DROP TESTS; BOARD-LEVEL; DROP TESTING; HIGH STRAIN RATES; IMPACT ENERGY; IMPACT FATIGUE; SOLDER ALLOYS; SOLDER JOINTS;

DUCTILITY; FAILURE ANALYSIS; FATIGUE CRACK PROPAGATION; FATIGUE TESTING; FRACTURE; IMPACT RESISTANCE; IMPACT TESTING; INTERMETALLICS; SILVER; SILVER ALLOYS; STEEL BRIDGES; TIN;

STRAIN RATE;

EID: 70349668445     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074245     Document Type: Conference Paper

References (13)

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