The influence of package-induced stresses on moulded Hall sensors

Microsystem Technologies

Volumn 12, Issue 1-2 SPEC. ISS., 2005, Pages 69-74

  Fischer, Sebastian ^a   Beyer, Harald ^b   Janke, Ralf ^b   Wilde, Jürgen ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b Micronas GmbH Freiburg   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; ELECTRIC CONDUCTIVITY; HALL EFFECT; SENSITIVITY ANALYSIS; SENSORS; TEMPERATURE DISTRIBUTION; VISCOELASTICITY;

ASSEMBLY PROCESS; HALL SENSOR; SENSITIVE LAYERS; TEMPERATURE CHANGE;

STRESS ANALYSIS;

EID: 30344439142     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-005-0019-5     Document Type: Conference Paper

References (6)

1. Bittle DA, Suhling JC, Beaty RE, Jaeger RC, Johnson RW (1991) Piezoresistive stress sensors for structural analysis of electronic packages. J Electron Packaging 113:203-215
2. Deier E, Wilde J (2003) Thermo-mechanical behavior of the die attachment adhesive of a MEMS pressure sensor. In: 14th European microelectronics and packaging conference and exhibition Friedrichshafen, Germany, 23-25 June 2003
3. Fischer S, Wilde J, Deier E, Zukowski E (2004) Influence of materials data on the performance modelling in the design of MEMS packages. In: Symposium on advanced packaging, IEEE, 2004
4. Hälg B (1988) Piezo-Hall coefficients of n-type silicon. J Appl Phys 64:276-282
5. Manic D, Petr J, Popovic RS (2000) Short and long-term stability of Hall plates in plastic packages. In: IEEE, 38th international reliability physics symposium, San Jose, CA, 2000
6. Wilde J, Deier E (2003) Einfluss des nichtlinearen Verhaltens der Montageklebung auf die Genauigkeit mikromechanischer Drucksensoren. In: Proceedings of the ninth GMM-workshop, Bielefeld, 31 March 2003/01 April 2003