Modern test methods for a comprehensive thermo-mechanical deformation analysis in area-array-assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 599-605

  Pustan, David ^a   Wilde, Juergen ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MECHANICAL DEFORMATIONS; TEST METHODS;

BRAZING; COMPUTER NETWORKS; DEFORMATION; ELASTICITY; ELECTRIC CURRENTS; FINITE ELEMENT METHOD; RELIABILITY; SILICON; STRUCTURAL DESIGN; SYSTEMATIC ERRORS; THERMOMECHANICAL TREATMENT; WELDING;

TESTING;

EID: 51349094411     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550034     Document Type: Conference Paper

References (9)

1. st Electronics Systemintegration Technology Conference, Dresden, Sept. 2006, pp. 1003-1007
2. S.T. Lin, J.C. Suhling, R.W. Johnson, B. Han, J.L. Evens, "Finite element and Moire interferometry study of chip capacitor reliability.", Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference. INTERpack '97, ASME. Part vol.2,. New York, 1997, pp. 1687-94
3. rd GMM-Fachtagung, Fellbach, Feb. 2006, pp. 317-322
4. J. Bartholomeyczik, S. Brugger, P. Ruther, O. Paul "Multidimensional CMOS in-plane stress sensor", IEEE Sensors Journal, Vol. 5, No. 5 (2005), pp. 872-882
5. J.C. Suhling, R.C. Jaeger "Silicon piezoresistive stress sensors and their application in electronic packaging", IEEE Sensors Journal, Vol. 1, No. 1 (2005), pp. 14
6. D. Pustan, S. Fischer und J. Wilde, "Analysis of field loads in automotive ECUs and MEMS sensors", 57th Electronic Components & Technology Conference, Reno, 2007, pp. 1697-1700
7. st Electronics Systemintegration Technology Conference, Dresden, Sept. 2006, pp. 1378-1385
8. S. Fischer, H. Beyer, R. Janke. S. Hartwig, J. Wilde, "The influence of package-induced stresses on moulded Hall sensors", Microsystem Technologies, Vol. 12, No. 1-2 (2005), pp. 69-74
9. Fischer S., Beyer H., Janke R., Hartwig S., Wilde J., "Comparison of analysis methods for package-induced stresses on moulded Hall sensors", Microsystem Technologies, Vol. 12, No. 10-11 (2006), pp. 1005-1009