Interfacial IMC and Kirkendall void on SAC solder joints subject to thermal cycling

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

Volumn 2, Issue , 2005, Pages 863-867

  Luhua, Xu ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COALESCENCE; ETCHING; INTERFACES (MATERIALS); RELIABILITY; SPUTTERING; THERMAL CYCLING;

ISOTHERMAL AGING; KIRKENDALL VOID; THERMAL CYCLING AGING;

SOLDERED JOINTS;

EID: 33847288837     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. John H. L. Pang, T. H. Low, Xu Luhua et al. Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength Thin Solid Films, 2004 (462-463): 370-375
2. K. Zeng, K. N. Tu. Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Materials Science and Engineering R. 2002, 38(2): 55-105
3. Luhua Xu, John H. L. Pang, Kithva H. Prakash, and T. H. Low, Isothermal and Thermal Cycling Aging on IMC Growth Rate in Lead-Free and Lead-Based Solder Interface. IEEE Transactions on Components and Packaging Technologies(TCPT), 2005.28(3)
4. John H.L. Pang, and Luhua Xu Intermetallic Growth Studies on Sn-Ag-Cu Lead-Free Solder Joints. Journal of Electronic Materials, 2004 (33-10): 1219
5. P. T. Vianco, et al., "Intermetallic compound layer development during the solid state thermal aging of 63Sn3Pb solder/Au-Pt-Pd thick film couples", IEEE Trans. CPMT-A, 20, 1997, p478.
6. th Electronic Components and Technology Conference(ECTC), USA
7. th Electronic Components and Technology Conference(ECTC), USA
8. Kejun Zeng, Roger Stierman, and K.N.Tu. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability Journal of Applied Physics 97, 024508 (2005)