Application of a nano-mechanical sensor to monitor stress in copper damascene interconnects

Applied Physics Express

Volumn 2, Issue 9, 2009, Pages

  Wilson, Christopher J ^a,b   Croes, Kristof ^b   Tokei, Zsolt ^b   Vereecke, Bart ^b   Beyer, Gerald P ^b   O'Neill, Anthony G ^a   Horsfall, Alton B ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEAL TEMPERATURES; AVERAGE STRESS; BACK END OF LINES; COPPER DAMASCENE INTERCONNECTS; CURRENT TECHNIQUES; DAMASCENE CU INTERCONNECTS; DEEP SUB-MICRON; MECHANICAL SENSORS; METALLIZATIONS; NANOSCALE CHARACTERIZATION; STRESS EVOLUTION;

GRAIN GROWTH; NANOSENSORS; OPTICAL INTERCONNECTS;

STRESSES;

EID: 70349096300     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.1143/APEX.2.096503     Document Type: Article

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