Low temperature PE-TEOS oxide bonding assisted by a thin layer of high- κ dielectric

Electrochemical and Solid-State Letters

Volumn 12, Issue 11, 2009, Pages

  Chong, G Y ^a   Tan, C S ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH; BONDING INTERFACES; CAPPING LAYER; LOW TEMPERATURES; SURFACE ACTIVATION; TETRA-ETHYL-ORTHO-SILICATE; THIN LAYERS; TIO;

BOND STRENGTH (MATERIALS); DIELECTRIC MATERIALS; HAFNIUM COMPOUNDS; THIN FILMS;

WAFER BONDING;

EID: 70249095540     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3207872     Document Type: Article

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