Low-temperature direct CVD oxides to thermal oxide wafer bonding in silicon layer transfer

Electrochemical and Solid-State Letters

Volumn 8, Issue 1, 2005, Pages

  Tan, C S ^a   Chen, K N ^a   Fan, A ^a   Reif, R ^a  

^a Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; BOND STRENGTH (MATERIALS); DIELECTRIC MATERIALS; HYDROGEN BONDS; MICROELECTROMECHANICAL DEVICES; OXIDATION; SILICON WAFERS; STRESS ANALYSIS; THIN FILMS;

INTERLAYER DIELECTRICS (ILD); MEMS; SILICON-ON-INSULATOR (SOI); SOI WAFERS;

CHEMICAL VAPOR DEPOSITION;

EID: 12344280110     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1825292     Document Type: Article

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