Microelectronics thin film handling and transfer using low-temperature wafer bonding

Electrochemical and Solid-State Letters

Volumn 8, Issue 12, 2005, Pages

  Tan, C S ^a,b   Reif, R ^a,b  

^a Massachusetts Institute of Technology Cambridge   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SILICON SUBSTRATE WAFER; THERMOCOMPRESSION BONDING;

CHEMICAL BONDS; COPPER; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS;

THIN FILMS;

EID: 28044433412     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2119549     Document Type: Article

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