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Applied Physics Letters

Volumn 95, Issue 6, 2009, Pages

Effects of Ni cladding layers on suppression of Ag agglomeration in Ag-based Ohmic contacts on p-GaN

(4) Son, Jun Ho a Song, Yang Hee a Yu, Hak Ki a Lee, Jong Lam a

a Pohang University of Science and Technology (POSTECH) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AG ATOMS; AG CONTACTS; AG FILMS; AG(100); AG-BASED OHMIC CONTACT; CLADDING LAYER; CONTACT RESISTIVITIES; HIGH RESOLUTION X RAY DIFFRACTION; INVESTIGATE EFFECTS; LIGHT REFLECTANCE; NI CONTACTS; PASSIVATION LAYER; ULTRA-THIN;

AGGLOMERATION; EPITAXIAL GROWTH; GALLIUM ALLOYS; GALLIUM NITRIDE; LIGHT; NICKEL; OHMIC CONTACTS; PASSIVATION; SEMICONDUCTING GALLIUM; SURFACE DIFFUSION; ULTRATHIN FILMS;

SILVER;

EID: 69049118169 PISSN: 00036951 EISSN: None Source Type: Journal
DOI: 10.1063/1.3206742 Document Type: Article

Times cited : (39)

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