Low temperature fluxless bonding technique using In-Sn composite

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 114-118

  Choe, Selah ^a   So, William W ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; ELECTRON DEVICES; EUTECTICS; HEAT FLUX; HYDROGEN; INDIUM ALLOYS; LOW TEMPERATURE OPERATIONS; METALLOGRAPHIC MICROSTRUCTURE; OXIDATION; SILICON WAFERS; SOLDERED JOINTS; SOLDERING;

LOW TEMPERATURE FLUXLESS BONDING; OXIDATION FREE SOLDERING; SCANNING ACOUSTIC MICROSCOPY; VOID FREE JOINTS;

ELECTRONICS PACKAGING;

EID: 0034478729     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)