Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 1-3, 2007, Pages 93-119

  Vianco, Paul T ^a   Rejent, Jerome A ^a   Fossum, Arlo F ^a   Neilsen, Michael K ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSION TESTING; CREEP TESTING; MICROELECTROMECHANICAL DEVICES; OPTOELECTRONIC DEVICES; PLASTICITY; SOLDERING ALLOYS; STRAIN; STRESSES;

COMPRESSION STRESS-STRAIN; SOLDER MECHANICAL PROPERTIES; STEADY-STATE CREEP; UNIFIED CREEP-PLASTICITY;

INDIUM ALLOYS;

EID: 33845703257     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9013-7     Document Type: Article

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