Characterization of flexible copper laminates fabricated by Cu electro-plating process

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 19, Issue 4, 2009, Pages 965-969

  LEE, Chang Min ^a   LIM, Jun Hyung ^a   HWANG, Soo Min ^a   PARK, Eui Cheol ^a   SHIM, Jong Hyun ^a   PARK, Jin Hyun ^a   JOO, Jinho ^a   JUNG, Seung Boo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

current density; electro plating; Faraday's law; FCCL; microstructure

Indexed keywords

COMBINED EFFECT; COPPER LAMINATES; CU LAYERS; ELECTRICAL RESISTIVITY; FARADAY'S LAW; FCCL; FLEXIBLE COPPER CLAD LAMINATE; FOLDING BEHAVIOR; FOLDING ENDURANCE; HARDNESS VALUES; NANOINDENTATION TECHNIQUES; NUMBER OF CYCLES; PLATING PROCESS; PREFERRED ORIENTATIONS; ROOT MEAN SQUARES; SECONDARY PHASIS;

ATOMIC FORCE MICROSCOPY; DIFFRACTION; ELECTRIC RESISTANCE; HARDNESS; HOLOGRAPHIC INTERFEROMETRY; LAWS AND LEGISLATION; MICROSTRUCTURE; MORPHOLOGY; PLATING; SURFACE MORPHOLOGY;

CURRENT DENSITY;

EID: 68549083512     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1003-6326(08)60387-8     Document Type: Article

References (9)

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