Effects of nodule treatment of rolled copper on the mechanical properties of the flexible copper-clad laminate

Microelectronic Engineering

Volumn 84, Issue 11, 2007, Pages 2653-2657

  Lee, Chang Yong ^a   Lee, Jae Hong ^a   Choi, Don Hyun ^a   Lee, Hoo Jeong ^a   Kim, Hyoung Sub ^a   Jung, Seung Boo ^a   Moon, Won Chul ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Flexible copper clad laminate; Nodule treatment; Peel strength; Rolled copper

Indexed keywords

BOND STRENGTH (MATERIALS); ELECTROPLATING; METAL FOIL; NICKEL; SURFACE ROUGHNESS;

FRACTURE LOCATION; NODULE TREATMENT; PEEL STRENGTH; PLATING PARAMETERS;

LAMINATES;

EID: 34548862026     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.05.063     Document Type: Article

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