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Volumn 19, Issue 7, 2009, Pages

Dual-side and three-dimensional microelectrode arrays fabricated from ultra-thin silicon substrates

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; FLIP CHIP DEVICES; MATERIALS HANDLING; MICROELECTRODES; REACTIVE ION ETCHING; SIGNAL TO NOISE RATIO; SILICON; SUBSTRATES;

EID: 67849099373     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/19/7/075008     Document Type: Article
Times cited : (53)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.