Formation of silicon nanoporous structures induced by colloidal gold nanoparticles in HF/H 2O 2 solutions

Chemistry of Materials

Volumn 21, Issue 13, 2009, Pages 2721-2726

  Zhu, Jianzhong ^a   Bart Smith, Hilary ^a   Begley, Matthew R ^a   Zangari, Giovanni ^a   Reed, Michael L ^a  

^a University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACIDIC SOLUTIONS; ADDITION OF HF; AU NANOPARTICLE; COLLOIDAL GOLD NANOPARTICLES; COLLOIDAL SOLUTIONS; COLLOIDAL SUSPENSIONS; CRYSTALLOGRAPHIC DIRECTIONS; DOPING LEVELS; EFFICIENT METHOD; ELECTROSTATIC REPULSION; ETCHING PROCESS; GOLD COLLOID; METAL FILM; NANO-SIZE; NANOPOROUS STRUCTURES; NEGATIVE CHARGE; NEGATIVE SURFACE CHARGES; NEUTRAL AQUEOUS SOLUTION; PATTERNED SILICON; POROUS SILICON STRUCTURES; PRE-COATING; SI SURFACES; SI-DOPING; SUBMICROMETER; UNIFORM PORE;

ADSORPTION; CELL MEMBRANES; COLLOID CHEMISTRY; COLLOIDS; ELECTRIC BATTERIES; ELECTROLYTIC CELLS; ETCHING; GOLD ALLOYS; NANOPARTICLES; POROUS SILICON; REFUSE DIGESTION; REFUSE DISPOSAL; SUSPENSIONS (FLUIDS);

GOLD;

EID: 67650649444     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm9002417     Document Type: Article

References (31)

1. Lehmann, V.; Gösele, U. Appl. Phys. Lett. 1991, 58, 856-858.
2. Nicewarner-Peña, S. R.; Freeman, R. G.; Reiss, B. D.; He, L.; J. Peña, D.; Walton, I. D.; Cromer, R.; C. Keating, D.; Natan, M. J. Science 2001, 294, 137-141.
3. Lehmann, V.; Ronnebeck, S. Sens. Actuators, A 2001, 95, 202-207.
4. Fu, J.; Yoo, J.; Han, J. Phys. Rev. Lett. 2006, 97, 018103.
5. Striemer, C. C.; Gaborski, T. R.; McGrath, J. L.; Fauchet, P. M. Nature 2007, 445, 749-753.
6. Turner, D. R. J. Electrochem. Soc. 1958, 105, 402-408.
7. Uhlir, A. Jr. Bell Syst. Tech. J. 1956, 35, 333-347.
8. Smith, R. L.; Collins, S. D. J. Appl. Phys. 1992, 71, R1-R22.
9. Föll, H.; Christophersen, M.; Carstensen, J.; Hasse, G. Mater. Sci. Eng., R 2002, 39, 93-141.
10. Li, X.; Böhn, P. Appl. Phys. Lett. 2000, 77, 2572-2574.
11. Peng, K.; Wu, Y.; Fang, H.; Zhong, X.; Xu, Y.; Zhu, J. Angew. Chem., Int. Ed. 2005, 44, 2737-2742.
12. Asoh, H.; Arai, F.; Ono, S. Electrochem. Commun. 2007, 9, 535-539.
13. Ono, S.; Oide, A.; Asoh, H. Electrochim. Acta 2007, 52, 2898-2904.
14. Tsujino, K.; Matsumura, M. Adv. Mater. 2005, 17, 1045-1047.
15. Hill, R. M. Proc. R. Soc. London, Ser. A 1969, 309, 397-417.
16. Diegoli, S.; Mendes, P. M.; Baguley, E. R.; Leigh, S. J.; Iqbal, P.; Diaz, Y. R. G.; Begum, S.; Critchley, K.; Hammond, G. D.; Evans, S. D.; Attwood, D.; Jones, I. P.; Preece, J. A. J. Exp. Nanosci. 2006, 1, 333-353.
17. Koynov, S.; Brandt, M. S.; Stutzmann, M. Appl. Phys. Lett. 2006, 88, 203107.
18. Imou, N.; Ishiyama, T.; Omuraa, Y. J. Electrochem. Soc. 2006, 153, G59-66.
19. Gaines, G. L.; Tabor, D. Nature 1956, 178, 1304-1305.
20. Maslova, M. V.; Gerasimova, L. G.; Forsling, W. Colloid J. 2004, 66, 322-328.
21. Heyns, M. M.; Mertens, P. W.; Bearda, T.; Mertens, S.; Cornelissen, I.; Meuris, M.; De Gendt, S.; Nigam, T.; Degraeve, R.; Schaekers, M.; Groeseneken, G.; Teerlinck, I.; Kenens, C.; Vandervorst, W.; Knotter, D. M.; Vos, R.; Loewenstein, L. M.; Wolke, K. IBM J. Res. Dev. 1999, 43, 339-350.
22. Ta, T. C.; Sykes, M. T.; McDermott, M. T. Langmuir 1998, 14, 2435-2443.
23. Turkevich, J.; Stevenson, P. C.; Hillier, J. Discuss. Faraday Soc. 1951, 11, 55-75.
24. Diegoli, S.; Mendes, P. M.; Baguley, E. R.; Leigh, S. J.; Iqbal, P.; Garcia Diaz, Y. R.; Begum, S.; Critchley, K.; Hammond, G. D.; Evans, S. D.; Attwood, D.; Jones, I. P.; Preece, J. A. J. Exp. Nanosci. 2006, 3, 333-353.
25. Woodruff, J. H.; Ratchford, J. B.; Goldthorpe, I. A.; McIntyre, P. C.; Chidsey, C. E. D. Nano Lett. 2007, 7, 1637-1642.
26. Shukla, A. K.; Raman, R. K. Annu. Rev. Mater. Res. 2003, 33, 155-68.
27. Zhang, X. G. J. Electrochem. Soc. 2004, 151, C69-C80.
28. Kooij, E. S.; Vanmaekelbergh, D. J. Electrochem. Soc. 1997, 144, 1296-1301.
29. Kolasinski, K. W. Phys. Chem. Chem. Phys. 2003, 5, 1270-1278.
30. Searson, P. C.; Macaulay, J. M.; Ross, F. M. J. Appl. Phys. 1992, 72, 253-258.
31. Jager, C.; Finkenberger, B.; Jager, W.; Christophersen, M.; Car-stensen, J.; Foll, H. Mater. Sci. Eng., B 2000, 69-70, 199-204.