Cohesive zone modeling for structural integrity analysis of IC interconnects

Microelectronics Reliability

Volumn 47, Issue 8, 2007, Pages 1251-1261

  van Hal, B A E ^a   Peerlings, R H J ^a   Geers, M G D ^a   van der Sluis, O ^b  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DELAMINATION; DIELECTRIC MATERIALS; INTEGRATED CIRCUITS; PROBLEM SOLVING; RELIABILITY ANALYSIS; STRUCTURAL INTEGRITY;

DAMAGE MECHANICS; INTERFACIAL DAMAGE MODELS; THERMO-MECHANICAL RELIABILITY; WIRE BOND QUALIFICATION;

OPTICAL INTERCONNECTS;

EID: 34547227848     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2006.08.017     Document Type: Article

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