Miniaturised drug delivery system with wireless power transfer and communication

IET Seminar Digest

Volumn 2006, Issue 11367, 2006, Pages 155-162

  Smith, S ^a   Tang, T B ^a   Stevenson, J T M ^a   Flynn, B W ^a   Reekie, H M ^a   Murray, A F ^a   Gundlach, A M ^a   Renshaw, D ^a   Dhillon, B ^b   Ohtori, A ^c   Inoue, Y ^c   Walton, A J ^a  

^a UNIVERSITY OF EDINBURGH   (United Kingdom)

^b Princess Alexandria Eye Pavillion   (United Kingdom)

^c SENJU PHARMACEUTICAL CO LTD   (Japan)

Author keywords

Drug delivery; MEMS; Wireless power transfer

Indexed keywords

DRUG DELIVERY SYSTEM; KEY PERFORMANCE PARAMETERS; MINIATURE SYSTEMS; POWER CONSUMPTION; TIME PERIODS; TWO WAY COMMUNICATIONS; WIRELESS POWER TRANSFER;

ACTUATORS; DRUG DELIVERY; MEMS; MICROSENSORS; POWER CONTROL;

MICROELECTROMECHANICAL DEVICES;

EID: 67649961401     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1049/ic:20060457     Document Type: Conference Paper

References (20)

1. W. Benard, H. Kahn, A. Heuer, and M. Huff, "Thin- Film Shape-Memory Alloy Actuated Micropumps," IEEE Journal of Microelectromechanical Systems, vol. 7, no. 2, pp. 245-251, 1998.
2. M. Cresswell, J. Sniegowski, R. Ghoshtagore, R. Allen, W. Guthrie, A. Gurnell, L. Linholm, R. Dixson, and E. Teague, "Recent developments in electrical linewidth and overlay metrology for integrated circuit fabrication processes," Japanese Journal of Applied Physics Part 1-Regular Papers Short Notes & Review Papers, vol. 35, no.12B, pp. 6597-6609, 1996.
3. R. Frankenthal and D. Siconolfi, "The Anodic Corrosion of Gold in Concentrated Chloride Solutions," Journal of the Electrochemistry Society, vol. 129, no. 6, pp. 1192-1196, June 1982.
4. W. Gorham, "Para-Xylylene Polymers," US Patent Office, vol. 3,342,754, 1967.
5. S. Kingman, "Holey chips for drug delivery," Drug Discovery Today, vol. 6, no. 23, December 2001.
6. G. Kovacs, N. Maluf, and K. Petersen, "Bulk Micromachining of Silicon," Proceedings of the IEEE, vol. 86, no. 8, pp. 1536-1551, August 1998.
7. F. Laermer, A. Schilp, K. Funk, and M. Offenberg, "Bosch Deep Silicon Etching: Improving Uniformity and Etch Rate for Advanced MEMS Applications," in Twelfth IEEE International Conference on Micro Electro Mechanical Systems. MEMS '99., Orlando, FL USA, January 1999, pp. 211-216.
8. Y. Li, R. Shawgo, R. Langer, and M. Cima, "Mechanical Testing of Gold Membranes on a MEMS Device for Drug Delivery," in 2nd Annual International IEEE-EMB Special Topic Conference o Microtechnologies in Medicine and Biology, Madison, WI, USA, May 2002, pp. 390-393.
9. K. Lian, B. Stark, A. Gundlach, and A. Walton, "Aluminium passivation for TMAH based anisotropic etching for MEMS applications," Electronics Letters, vol. 35, no. 15, pp. 1266-1267, July 1999.
10. D. Maillefer, S. Gamper, B. Frehner, P. Balmer, H. van Lintel, and P. Renaud, "A High Performance Silicon Micropump for Disposable Drug Delivery Systems," in 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001, January 2001, pp. 413-417.
11. R. Reay, E. Klaassen, and G. Kovacs, "Thermally and Electrically Isolated Single Crystal Silicon Structures in CMOS Technology," IEEE Electron Device Letters, vol. 15, no. 10, pp. 399-401, October 1994.
12. D. Reynaerts, J. Peirs, and H. V. Brussel, "An implantable drug-delivery system based on shape memory alloy micro-acutation," Sensors and Actuators A, vol. 61, pp. 455-462, 1997.
13. J. Santini, M. Cima, and R. Langer, "A Controlled- Release Microchip," Nature, vol. 397, pp. 335-338, January 1999.
14. U. Schnakenberg, W. Benecke, and P. Lange, "TMAHW etchants for silicon micromachining," in Digest of Technical Papers; International Conference on Solid-State Sensors and Actuators (Transducers '91), San Francisco, CA, USA, June 1991, pp. 815-818.
15. P. Sinha, G. Valco, S. Sharma, X. Liu, and M. Ferrari, "Nanoengineered device for drug delivery application," Nanotechnology, vol. 15, pp. S585-S589, 2004.
16. 4NOH solutions," in International Conference on Solid-State Sensors and Actuators (Transducers '91), Digest of Technical Papers, San Francisco, CA, USA, June 1991, pp. 811-814.
17. C. Webb, "Chip shots," IEEE Spectrum, vol. 41, no. 10, October 2004.
18. K. Williams, K. Gupta, and M. Wasilik, "Etch Rates for Micromachining Processing Part II," IEEE Journal of Microelectromechanical Systems, vol. 12, no. 6, pp. 761-778, 2003.
19. S.Wolf, F. Jung, H. Kiesewetter, N. Körber, and M. Reim, "Video fluorescein angiography: method and clinical application," Graefe's Archive for Clinical and Experimental Ophthalmology, vol. 227, no. 2, pp. 145-151, March 1989.
20. J. Zahn, A. Deshmukh, A. Pisano, and D. Liepmann, "Continuous On-Chip Micropumping Through a Microneedle," in 14th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2001, January 2001, pp. 503-506.