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Key Engineering Materials

Volumn 261-263, Issue I, 2004, Pages 489-494

Reliability analysis in flip chip package under thermal cycling

(2) Yeh, M K a Tsai, C Y a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Finite element analysis; Flip chip package; Reliability analysis; Thermal cycling; Underfill

Indexed keywords

ELASTIC MODULI; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS;

BALL GRID ARRAYS; DIE THICKNESS; RELIABILITY ANALYSIS;

CHIP SCALE PACKAGES;

EID: 3142702208 PISSN: 10139826 EISSN: 16629795 Source Type: Book Series
DOI: 10.4028/www.scientific.net/kem.261-263.489 Document Type: Conference Paper

Times cited : (3)

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