Predicting optimal process conditions for flip-chip assembly using copper column bumped dies

Proceedings of 4th Electronics Packaging Technology Conference, EPTC 2002

Volumn , Issue , 2002, Pages 338-343

  Lu, H ^a   Bailey, C ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COPPER; ELECTRONICS PACKAGING; STRAIN ENERGY;

COMPUTER MODELLING; COPPER COLUMNS; DAMAGE INDICATOR; DESIGN PARAMETERS; FLIP CHIP ASSEMBLIES; OPTIMAL PROCESS; THERMAL CYCLIC LOADING; UNDER-BUMP METALLURGIES;

FLIP CHIP DEVICES;

EID: 84964675026     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2002.1185694     Document Type: Conference Paper

References (11)

1. J.H. Lau (editor), Flip Chip Technologies, McGraw-Hill, New York, 1996
2. C.H. Wang, A.S. Holmes and S. Gao, "Laser-assisted Bump Transfer for Flip Chip Assembly", Proceedings of International Symposium on Electronic Materials and Packaging (EMAP2000), Hong Kong,, 2000, pp86-90
3. J.H. Lao and Y. Pao, Solder Joint Reliability of BGA, CSP, Flip Chips, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, 1997, pp47-91
4. st ECTC, 2001, pp. 255-264
5. st IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1997, pp. 299-307
6. Lu, H., Bailey, C. and Cross, M., "Reliability Analysis of Flip Chip Designs Via Computer Simulation", J. of Electronic Packaging, vol. 122, 2000, pp. 214-219.
7. Brakke, K. A., Surface Evolver Manual, v. 2.14, August 1999, http://www.geom.umn.edu.
8. PHYSICA, Multi-Physics Ltd, London, http://www.multi-physics.com
9. R. Darveaux, K. Banerji, A. Mawer and G. Dody, "Reliability of Plastic Ball Grid Array Assembly", Ball Grid Array Technology, 1995,McGraw-Hill, pp379-442
10. R. Darveaux, "Solder Joint Fatigue Life Model", Design and Reliability of Solders and Solder Interconnections, 1997, pp213-218.
11. H. Lu and C. Bailey, "Modeling the Fatigue Life of Solder Joints for Surface Mount Resistors", Proceedings of International Symposium on Electronic Materials and Packaging (EMAP2000), Hong Kong, 2000, pp136-142