Role of trace elements on tensile behavior of accumulative roll-bonded pure copper

Journal of Materials Science

Volumn 40, Issue 13, 2005, Pages 3527-3529

  Jang, Younghwan ^a   Kim, Sangshik ^a   Han, Seungzeon ^b   Lim, Chayong ^b   Kim, Changjoo ^b   Goto, Masahiro ^c  

^a Gyeongsang National University   (South Korea)

^b Korea Institute of Machine and Materials   (South Korea)

^c OITA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION; COPPER; GRAIN BOUNDARIES; IMPURITIES; PHOSPHORUS; PLASTIC DEFORMATION; PRECIPITATION (CHEMICAL); STRAIN RATE; TENSILE PROPERTIES; TENSILE STRENGTH;

ACCUMULATIVE ROLL-BONDED (ARB); OXYGEN-FREE COPPER (OFC); PROCESS CYCLES;

TRACE ELEMENTS;

EID: 23744494689     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10853-005-2879-6     Document Type: Article

References (7)

1. Y. H. JANG, S. S. KIM, S. Z. HAN, C. Y. LIM, C. J. KIM and M. GOTO, Scripta Mater. 52 (2004) 21.
2. Y. H. JANG, S. S. KIM, S. Z. HAN, C. Y. LIM and C. J. KIM, J. Koi: Inst. Met. Mater. 42 (2004) in press.
3. J. C. KIM, Y. NISHIDA, H. ARIMA and T. ANDO, Mater: Lett. 57 (2003) 1689.
4. V. V. STOLYAROV, Y. T. ZHU, T. C. LOWE and R. Z. VALIEV, Mater. Sci. Eng. A303 (2001) 82.
5. Y. T. ZHU, H. JIZNG, J. JUANG and T. C. LOWE, Metall. Mater. Trans. A 32A (2001) 1559.
6. S. S. KIM, M. J. HAYNES and R. P. GANGLOFF, Mater. Sci. Eng. A203 (1995) 256.
7. S. Z. HAN, C. Y. LIM, C. J. KIM and S. S. KIM, Metall. Mater. Trans. A (2004) accepted.