Microstructure and tensile deformation of nanocrystalline Cu produced by pulse electrodeposition

Materials Science and Engineering: A

Volumn 517, Issue 1-2, 2009, Pages 316-320

  Zhang, Hanzhuo ^a   Jiang, Zhonghao ^b   Qiang, Yinghuai ^a  

^a CHINA UNIVERSITY OF MINING AND TECHNOLOGY   (China)

^b JILIN UNIVERSITY   (China)

Author keywords

Mechanical properties; Microstructure; Nanocrystalline; Plastic deformation; Strain rate

Indexed keywords

BRITTLE FRACTURE; ELECTRODEPOSITION; ELECTRODES; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOCRYSTALS; PLASTIC DEFORMATION; STRAIN RATE; TENSILE TESTING;

AVERAGE GRAIN SIZE; GRAIN SIZE DISTRIBUTION; HIGHER YIELD; NANOCRYSTALLINE CU; NANOCRYSTALLINES; PULSE ELECTRODEPOSITION; STRAIN-RATE SENSITIVITY; STRAIN-RATES; TENSILE DEFORMATION; TENSILE ELONGATION;

MICROSTRUCTURE;

EID: 67649388165     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2009.03.079     Document Type: Article

References (27)

1. Meyers M.A., Mishra A., and Benson D.J. Prog. Mater. Sci. 51 (2006) 427-556
2. Dalla Torre F., Van Swygenhoven H., and Victoria M. Acta Mater. 50 (2002) 3957-3970
3. Yim T.H., Yoon S.C., and Kim H.S. Mater. Sci. Eng. A 449-451 (2007) 836-840
4. Shen X., Lian J., Jiang Z., and Jiang Q. Mater. Sci. Eng. A 487 (2008) 410-416
5. Karimpoor A.A., Erb U., Aust K.T., and Paulmbo G. Scripta Mater. 49 (2003) 651-656
6. Lu L., Shen Y., Chen X., Qian L., and Lu K. Science 304 (2004) 422-426
7. Youssef K.M., Koch C.C., and Fedkiw P.S. Corros. Sci. 46 (2004) 51-64
8. Ramanauskas R., Gudavičiūtė L., Juškėnas R., and Ščit O. Electrochim. Acta 53 (2007) 1801-1810
9. Li H., and Ebrahimi F. Adv. Mater. 17 (2005) 1969-1972
10. Wei H., Hibbard G.D., Palumbo G., and Erb U. Scripta Mater. 57 (2007) 996-999
11. Youssef K.M., Scattergood R.O., Murty K.L., Horton J.A., and Koch C.C. Appl. Phys. Lett. 87 (2005) 091904
12. Schiøtz J., and Jacobsen K.W. Science 301 (2003) 1357-1359
13. Shan Z., Stach E.A., Wiezorek J.M.K., Knapp J.A., Follstaedt D.M., and Mao S.X. Science 305 (2004) 654-657
14. Wei Y.J., Su C., and Anand L. Acta Mater. 54 (2006) 3177-3190
15. Wang Y.M., Chen M.W., Zhou F.Z., and Ma E. Nature 419 (2002) 912-914
16. Wang K., Tao N.R., Liu G., Lu J., and Lu K. Acta Mater. 54 (2006) 5281-5291
17. Zhang H., Jiang Z., Lian J., and Jiang Q. Adv. Eng. Mater. 10 (2008) 41-45
18. Zhang H., Jiang Z., Lian J., and Jiang Q. Mater. Sci. Eng. A 479 (2008) 136-141
19. Wang Y.M., and Ma E. Mater. Sci. Eng. A 375-377 (2004) 46-52
20. Cheng S., Ma E., Wang Y.M., Kecskes L.J., Youssef K.M., Koch C.C., Trociewitz U.P., and Han K. Acta Mater. 53 (2005) 1521-1533
21. Jiang Z., Liu X., Li G., Jiang Q., and Lian J. Appl. Phys. Lett. 88 (2006) 143115
22. Wang G., Jiang Z., Zhang H., and Lian J. J. Mater. Res. 23 (2008) 2238-2244
23. Wei Q. J. Mater. Sci. 42 (2007) 1709-1727
24. Wei Y.J., Bower A.F., and Gao H.J. Acta Mater. 56 (2008) 1741-1752
25. Wei Y.J., and Gao H.J. Mater. Sci. Eng. A 478 (2008) 16-25
26. Jiang Z., Zhang H., Gu C., Jiang Q., and Lian J. J. Appl. Phys. 104 (2008) 053505
27. Lian J., Gu C., Jiang Q., and Jiang Z. J. Appl. Phys. 99 (2006) 076103