Fabrication of 3D comb drive microscanners by mechanically induced permanent displacement

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7208, Issue , 2009, Pages

  Jung, D ^a,b   Kallweit, D ^a   Sandner, T ^a   Conrad, H ^a,b   Schenk, H ^a   Lakner, H ^a,b  

^a FRAUNHOFER INSTITUTE FOR PHOTONIC MICROSYSTEMS   (Germany)

^b DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

AVC; Microscanner; Quasi static scanning; Solid body mechanism; SVC; Vertical comb drive; W2w bonding

Indexed keywords

AVC; MICROSCANNER; QUASI STATIC SCANNING; SOLID BODY MECHANISM; SVC; VERTICAL COMB DRIVE; W2W BONDING;

ELECTRIC NETWORK TOPOLOGY; ELECTROSTATIC ACTUATORS; MECHANISMS; MIRRORS; SCANNING;

WAFER BONDING;

EID: 67649171095     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.808210     Document Type: Conference Paper

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