Direct imprint of Al foil for metallization of high-aspect ratio Al lines in nano/micro patterned SiO2/Si

Microelectronic Engineering

Volumn 86, Issue 4-6, 2009, Pages 600-603

  Youn, Sung Won ^a   Ueno, Akihisa ^a   Okuyama, Chikeo ^a   Takagi, Hideki ^a   Takahashi, Masaharu ^a   Maeda, Ryutaro ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

Aluminum; Filling process; High aspect ratio; Micro nano structures; Thermal imprint lithography

Indexed keywords

AL FOILS; AL-METALLIZATION; FILLING PROCESS; HIGH-ASPECT RATIO; METALLIZATION; MICRO-ELECTRONIC DEVICES; MICRO/NANO-STRUCTURES; OPTICAL COMPONENTS; PATTERNING TECHNIQUES; PROCESSING STEPS; THERMAL IMPRINTS; THERMAL-IMPRINT LITHOGRAPHY; TRENCH FILLINGS;

ALUMINA; ALUMINUM; ALUMINUM FOIL; CHEMICAL VAPOR DEPOSITION; METALLIZING; NANOIMPRINT LITHOGRAPHY; PRESSURE DROP; RANGE FINDING; SILICON COMPOUNDS;

ASPECT RATIO;

EID: 67349144422     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.11.014     Document Type: Article

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