Thixotropy flow behavior of solder and conductive adhesive pastes

Journal of Materials Science: Materials in Electronics

Volumn 15, Issue 10, 2004, Pages 677-683

  Durairaj, R ^a   Ekere, N N ^a   Salam, B ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

HAHN MODEL; HYSTERESIS LOOP TEST; ISOTROPIC CONDUCTIVE ADHESIVES; SHEAR RATE; SOLDER PASTE; THIXOTROPY MODEL; WELTMAN MODEL;

ADHESIVE PASTES; CALCULATIONS; CONDUCTIVE PLASTICS; EPOXY RESINS; HYSTERESIS; MATHEMATICAL MODELS; MICROSTRUCTURE; MOLECULAR STRUCTURE; PRINTED CIRCUIT BOARDS; RHEOLOGY; SHEAR STRESS; SOLDERING ALLOYS;

SUSPENSIONS (FLUIDS);

EID: 4344595907     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSE.0000038923.62923.1e     Document Type: Article

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