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Volumn 49, Issue 6, 2009, Pages 621-626

Miniaturised multi-MEMS sensor development

Author keywords

[No Author keywords available]

Indexed keywords

BULK MICROMACHINING TECHNOLOGIES; CHARACTERISATION; CORROSION MONITORS; DISCRETE COMPONENTS; ENVIRONMENTAL CONDITIONS; ENVIRONMENTAL MONITORING SYSTEMS; ENVIRONMENTAL PARAMETERS; FORCED CONVECTIVE HEAT TRANSFERS; GAS-FLOW VELOCITIES; LOW FLOWS; MEASURAND; MEMS SENSORS; POWER CONSUMPTION; SENSING PLATFORMS; SENSOR SYSTEMS; SILICON SUBSTRATES; SPACE CONSUMPTION; TEMPERATURE AND HUMIDITY SENSORS; TYNDALL;

EID: 67349111681     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.02.017     Document Type: Article
Times cited : (25)

References (17)
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    • 25 mm Sensor-actuator layer: a miniature, highly adaptable interface layer
    • Barton J., Hynes G., O'Flynn B., Aherne K., Norman A., and Morrissey A. 25 mm Sensor-actuator layer: a miniature, highly adaptable interface layer. Sensor Actuat A-Phys 132 November (2006) 362-369
    • (2006) Sensor Actuat A-Phys , vol.132 , Issue.November , pp. 362-369
    • Barton, J.1    Hynes, G.2    O'Flynn, B.3    Aherne, K.4    Norman, A.5    Morrissey, A.6
  • 4
    • 67349119852 scopus 로고    scopus 로고
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    • 0036786763 scopus 로고    scopus 로고
    • Interdigitated humidity sensors for a portable clinical microsystem
    • Laville C., and Pellet C. Interdigitated humidity sensors for a portable clinical microsystem. IEEE Trans Biomed Eng 49 10 (2002) 1162-1167
    • (2002) IEEE Trans Biomed Eng , vol.49 , Issue.10 , pp. 1162-1167
    • Laville, C.1    Pellet, C.2
  • 11
    • 0141830175 scopus 로고    scopus 로고
    • Micromachine-based humidity sensors with integrated temperature sensors for signal drift compensation
    • Lee C.Y., and Lee G.B. Micromachine-based humidity sensors with integrated temperature sensors for signal drift compensation. J Micromech Microeng 13 (2003) 620-627
    • (2003) J Micromech Microeng , vol.13 , pp. 620-627
    • Lee, C.Y.1    Lee, G.B.2
  • 14
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    • The use of special purpose assembly test chips for evaluating reliability in packaged devices. In: International workshop on wafer level reliability
    • Final report, 25-28 October;
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    • Sweet, J.N.1
  • 15
    • 0033537521 scopus 로고    scopus 로고
    • Thermal flow sensors for liquid and gases based on combinations of two principles
    • Aschauer M., Glosch H., Hedrich F., Hey N., Sandmaier H., and Lang W. Thermal flow sensors for liquid and gases based on combinations of two principles. Sensor Actuat A 73 1-2 (1999) 7-13
    • (1999) Sensor Actuat A , vol.73 , Issue.1-2 , pp. 7-13
    • Aschauer, M.1    Glosch, H.2    Hedrich, F.3    Hey, N.4    Sandmaier, H.5    Lang, W.6
  • 17
    • 0033357132 scopus 로고    scopus 로고
    • Thermal flow microsensors
    • Elwenspoek M. Thermal flow microsensors. CAS99 4 2 (1999) 423-425
    • (1999) CAS99 , vol.4 , Issue.2 , pp. 423-425
    • Elwenspoek, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.