Use of 3D metrology for process control

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7272, Issue , 2009, Pages

  Rijpers, Bart ^a   Finders, Jo ^a   Suzuki, Hidekazu ^b   Fujii, Toshiaki ^b   Yamazaki, Yuichiro ^c   Abe, Hideaki ^c   Pérez Willard, Fabian ^d  

^a ASML   (Netherlands)

^b SII NanoTechnology   (Japan)

^c TOSHIBA CORPORATION   (Japan)

^d CARL ZEISS SMT AG   (Germany)

Author keywords

APC; Ar; Calibration; FIB; Linewidth; SEM; TEM

Indexed keywords

APC; AR; FIB; SEM; TEM;

ARGON; CALIBRATION; CHEMICAL PLANTS; FOCUSED ION BEAMS; MEASUREMENTS; PHOTORESISTORS; PROTECTIVE COATINGS; SILICON WAFERS; SURFACE TREATMENT; THREE DIMENSIONAL;

PROCESS CONTROL;

EID: 66649125212     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.816370     Document Type: Conference Paper

References (11)

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10. Personal communication with Dr. Heiko Stegmann, Carl Zeiss SMT
11. Measured data from Tatsuya Asahata, SII Nanotechnology