A comparison of focused ion beam and electron beam induced deposition processes

Microelectronics Reliability

Volumn 36, Issue 11-12 SPEC. ISS., 1996, Pages 1779-1782

  Lipp, S ^a   Frey, L ^b   Lehrer, C ^a   Demm, E ^c   Pauthner, S ^c   Ryssel, H ^a,b  

^a FRAUNHOFER INSTITUTE FOR INTEGRATED CIRCUITS IIS   (Germany)

^b UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

^c SIEMENS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTIVE FILMS; DEPOSITION; ELECTRIC INSULATING COATINGS; ELECTRON BEAM LITHOGRAPHY; INTEGRATED CIRCUIT LAYOUT; MICROMACHINING; SCANNING ELECTRON MICROSCOPY; INSULATING MATERIALS; ION BEAM LITHOGRAPHY; MASKS;

INTEGRATED CIRCUIT DESIGN EDITING; PARTICLE BEAM INDUCED DEPOSITION PROCESSES; ELECTRON BEAM INDUCED DEPOSITION; ION BEAM INDUCED DEPOSITION;

ION BEAM LITHOGRAPHY; INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030274008     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/0026-2714(96)00196-5     Document Type: Article

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