The generic nature of the Smart-Cut® process for thin film transfer

Journal of Electronic Materials

Volumn 30, Issue 7, 2001, Pages 834-840

  Aspar, B ^a   Moriceau, H ^a   Jalaguier, E ^a   Lagahe, C ^a   Soubie, A ^a   Biasse, B ^a   Papon, A M ^a   Claverie, A ^b   Grisolia, J ^b   Benassayag, G ^b   Letertre, F ^c   Rayssac, O ^c   Barge, T ^c   Maleville, C ^c   Ghyselen, B ^c  

^a CEA LETI   (France)

^b CEMES CNRS   (France)

^c PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

Ion implantation; LiNbO3; Si; SOI; Wafer bonding

Indexed keywords

CRACK PROPAGATION; DIFFUSION; HYDROGEN; LITHIUM NIOBATE; SEMICONDUCTING SILICON; STRUCTURE (COMPOSITION);

HYDROGEN DIFFUSION; OSTWALD RIPENING; SILICON ON INSULATOR MATERIAL; THERMALLY INDUCED SPLITTING; WAFER BONDING;

ION IMPLANTATION;

EID: 6644219832     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0067-2     Document Type: Article

References (22)