Basic mechanisms involved in the Smart-Cut® process

Microelectronic Engineering

Volumn 36, Issue 1-4, 1997, Pages 233-240

  Aspar, B ^a   Bruel, M ^a   Moriceau, H ^a   Maleville, C ^a   Poumeyrol, T ^a   Papon, A M ^a   Claverie, A ^b   Benassayag, G ^b   Auberton Herve A J ^c   Barge, T ^c  

^a CEA LETI   (France)

^b CEMES CNRS   (France)

^c PARC TECHNOLOGIQUE DES FONTAINES   (France)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; HYDROGEN; ION IMPLANTATION; PROTONS; SEMICONDUCTING FILMS; SILICON WAFERS; THIN FILMS; ADHESION; GLASS BONDING; SEMICONDUCTOR DEVICE STRUCTURES;

SMART CUT PROCESS; SPLITTING MECHANISM; WAFER BONDING; PROTON IMPLANTATION; SPLITTING EFFECT;

SILICON ON INSULATOR TECHNOLOGY;

EID: 0031150267     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(97)00055-5     Document Type: Article

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