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Volumn 7205, Issue , 2009, Pages

Shallow Fresnel lens fabrication using grey scale lithography made by high energy beam sensitive mask (HEBS) technology and reactive ion etching

Author keywords

Deep reactive ion etching (DRIE); Design of experiment (DOE).; Fresnel lens; Gray scale lithography (GSL); High energy beam sensitive (HEBS) glass; Reactive ion etching (RIE)

Indexed keywords

DEEP REACTIVE ION ETCHING (DRIE); DESIGN OF EXPERIMENT (DOE).; FRESNEL LENS; GRAY SCALE LITHOGRAPHY (GSL); HIGH ENERGY BEAM SENSITIVE (HEBS) GLASS; REACTIVE ION ETCHING (RIE);

EID: 65349159332     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.809376     Document Type: Conference Paper
Times cited : (11)

References (10)
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  • 3
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  • 5
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    • Microfabrication of 3-D silicon MEMS structures using gray scale lithography and deep reactive ion etching
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    • Morgen, B., Compensated aspect ratio dependent etching (CARDE) using gray scale technology, microelectronic engineering. 77, 85-74 (2005).
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  • 8
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    • Walter, D., one step lithography for mass production of multilevel diffractive optical elements using: High Energy Beam Sensitive (HEBS) gray level mask, SPIE: diffractive and holographic technology 3. 2698,153-155 (1996).
    • Walter, D.," one step lithography for mass production of multilevel diffractive optical elements using: High Energy Beam Sensitive (HEBS) gray level mask," SPIE: diffractive and holographic technology 3. 2698,153-155 (1996).
  • 9
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    • Plasma diagnostics of SF6 radiofrequency discharge used for etching of silicon
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.