Modeling pattern dependencies in the micron-scale embossing of polymeric layers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7269, Issue , 2008, Pages

  Taylor, Hayden ^a   Iliescu, Ciprian ^b   Ni, Ming ^b   Xing, Chen ^c,d   Lam, Yee Cheong ^c   Boning, Duane ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b INSTITUTE OF BIOENGINEERING AND NANOTECHNOLOGY   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^d SINGAPORE MIT ALLIANCE   (Singapore)

Author keywords

Hot embossing; Micro embossing; Polymethylmethacrylate; Polysulfone; Simulation; Thermoplastic polymers

Indexed keywords

HOT EMBOSSING; MICRO-EMBOSSING; POLYMETHYLMETHACRYLATE; SIMULATION; THERMOPLASTIC POLYMERS;

NANOTECHNOLOGY; PACKAGING MATERIALS; POLYESTERS; PRECISION ENGINEERING; REINFORCED PLASTICS; SEALS;

POLYMERS;

EID: 65349105871     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.810732     Document Type: Conference Paper

References (12)

1. Taylor, H., Boning, D., Iliescu, C. and Chen, B., "Computationally efficient modelling of pattern dependencies in the micro-embossing of thermoplastic polymers," Microelectronic Engineering, 85, 1453-6 (2008).
2. Chu, P., "Avery dennison micro-nano replication capabilities for MEMS and microfluidics," Proc. International Conference on MEMS, Nano and Smart Systems, 27 (2005).
3. Ulsh, M. J., Strobel, M. A., Serino, D. F. and Keller, J. T., "Embossed optical polymer films," US Patent 6096247 (2000).
4. Ames, N. M., "A thermo-mechanical finite deformation theory of plasticity for amorphous polymers : application to micro-hot-embossing of poly(methyl methacrylate)," Ph. D. dissertation, Massachusetts Institute of Technology (2007).
5. Johnson, K. L., Contact Mechanics, Cambridge (1985).
6. O'Sullivan, T. C. and King, R. B., "Sliding contact stress field due to a spherical indenter on a layered elastic half-space," Transactions of the ASME: Journal of Tribology, 110, 235-40 (1988).
7. Peng, W. and Bhushan, B. "A numerical three-dimensional model for the contact of layered elastic/plastic solids with rough surfaces by a variational principle," Journal of Tribology, 123, 330-342 (2001).
8. Nogi, T. and Kato, T., "Influence of a hard surface layer on the limit of elastic contact - Part I: Analysis using a real surface model," Transactions of the ASME: Journal of Tribology, 119, 493-500 (1997).
9. Iliescu, C., Tay, F. E. H. and Wei, J., "Low stress PECVD-SiNx layers at high deposition rates using high power and high frequency for MEMS applications," J Micromech Microengineering, 16, 869-74 (2006).
10. Hirai, Y., Konishi, T., Yoshikawa, T. and Yoshida, S., "Simulation and experimental study of polymer deformation in nanoimprint lithography," Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures, 22, 3288-3293 (2004).
11. Rowland, H. D., King, W. P., Sun, A. C. and Schunk, P. R., "Impact of polymer film thickness and cavity size on polymer flow during embossing: Toward process design rules for nanoimprint lithography," J Micromech Microengineering, 15, 2414-2425 (2005).
12. Rowland, H. D. and King, W. P., "Polymer deformation and filling modes during microembossing," J Micromech Microengineering, 14, 1625-1632 (2004).