Process mechanism for vacuum-assisted microfluidic lithography with ceramic colloidal suspensions

Journal of the American Ceramic Society

Volumn 91, Issue 7, 2008, Pages 2143-2149

  Ahn, Sung Jin ^a   Min, Ji Hyun ^a   Kim, Joosun ^b   Moon, Jooho ^a  

^a Yonsei University   (South Korea)

^b Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA SUSPENSIONS; CERAMIC STRUCTURES; CHANNEL WIDTHS; COLLOIDAL SUSPENSIONS; CRITICAL LEVELS; DRYING MECHANISMS; ETHANOL-BASED SUSPENSIONS; FLUIDIC RESISTANCES; IN VACUUMS; INFILTRATION KINETICS; MICRO-PATTERNED; MICROMOLDING IN CAPILLARIES; PATTERN STRUCTURES; PROCESS MECHANISMS; SOLID LOADINGS; VACUUM-ASSISTED MICROFLUIDIC LITHOGRAPHIES; WELL-DISPERSED;

ALUMINA; CERAMIC MATERIALS; DEWATERING; ETHANOL; LOADING; MICROCHANNELS; SEEPAGE; SOIL MECHANICS; VACUUM;

SUSPENSIONS (FLUIDS);

EID: 64549123501     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2008.02458.x     Document Type: Article

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