An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling

Applied Thermal Engineering

Volumn 28, Issue 5-6, 2008, Pages 433-439

  Xie, X L ^a   He, Y L ^a   Tao, W Q ^a   Yang, H W ^b  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b Dalian Sunway Heat Transfer Technique Co Ltd   (China)

Author keywords

Experimental investigation; Integrated heat pipe heat sink; Thermal performance; Wick structure

Indexed keywords

COOLING SYSTEMS; HEAT PIPES; MACHINE DESIGN; PRESSURE DROP; TEMPERATURE CONTROL;

CHIP COOLING; EXPERIMENTAL INVESTIGATION; INTEGRATED HEAT PIPE-HEAT SINK; THERMAL PERFORMANCE; WICK STRUCTURE;

HEAT SINKS;

EID: 38349185420     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2007.05.010     Document Type: Article

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