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High aspect ratio micromachining (HARM) technologies for microinertial devices
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to be published
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M E McNie, D O King, C A Vizard, A S Holmes & K W Lee, "High aspect ratio micromachining (HARM) technologies for microinertial devices", J. Microsystems Technologies - to be published
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J. Microsystems Technologies
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McNie, M.E.1
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Advanced silicon etching using high density plasmas
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Micromachining and Microfabrication Technology, SPIE, Austin (USA)
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Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process)
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Becker, E.1
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Polysilicon process development for fully integrated surface micromachined Accelerometer with CMOS electronics
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D O King, M C L Ward, K M Brunson & D J Hamilton, "Polysilicon Process Development for Fully Integrated Surface Micromachined Accelerometer with CMOS Electronics", Sensors & Actuators, Vol. A68, p238-243, 1998.
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King, D.O.1
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6
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Development of a mechanical polysilicon layer for surface machined microelectromechanical systems using TEM, SEM, and Raman spectroscopy
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Oxford (UK), IOP Conf. No. 157
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D O King, M C Ward, A G Cullis, D Gardiner & M Bowden, "Development of a mechanical polysilicon layer for surface machined microelectromechanical systems using TEM, SEM, and Raman spectroscopy", Proc. Microscopy of Semiconducting Materials, Oxford (UK), 1997, IOP Conf. No. 157, p443-446
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Polysilicon micromachining and industry
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London (UK), IEE Digest 97/018
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D O King, M E McNie & M C L Ward, "Polysilicon Micromachining and Industry", Proc. Recent Advances in Micromachining Techniques, London (UK), 1997, IEE Digest 97/018, pl/1-1/2
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King, D.O.1
McNie, M.E.2
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8
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Deep dry etching of SOI for silicon micromachined structures
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Yosemite (USA), Digest No. 97CH36069
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M. E. McNie, D. O. King, V Nayar, M. C. L. Ward, J S Burdess, C. Quinn & S. Blackstone, "Deep Dry Etching of SOI for Silicon Micromachined Structures", Proc. IEEE Int. SOI Conference, Yosemite (USA), 1997, Digest No. 97CH36069,p60-61
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McNie, M.E.1
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Quinn, C.6
Blackstone, S.7
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9
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CMOS compatibility of high aspect ratio micromachining (HARM) in bonded silicon-on-insulator (BSOI)
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SPIE-3511, Santa Clara (USA)
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M E McNie & D O King, "CMOS compatibility of High Aspect Ratio Micromachining (HARM) in bonded Silicon-on-Insulator (BSOI)", Int. Micromachining & Microfabrication Symposium, SPIE-3511, Santa Clara (USA), 1998, p277-287
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(1998)
Int. Micromachining & Microfabrication Symposium
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McNie, M.E.1
King, D.O.2
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10
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0032277354
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Novel silicon nitride micromachined wide bandwidth ultrasonic transducers
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Sendai (Japan)
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R A Noble, R J Bozeat, T J Robertson, D R Billson & D A Hutchins, "Novel Silicon Nitride Micromachined Wide Bandwidth Ultrasonic Transducers", Proc. IEEE Ultrasonics Symposium, Sendai (Japan), 1998, Vol. 2, p1081-1084
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Noble, R.A.1
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