High aspect ratio micromachining (HARM) technologies for microinertial devices

Microsystem Technologies

Volumn 6, Issue 5, 2000, Pages 184-188

  McNie, M ^a   King, D ^a   Vizard, C ^a   Holmes, A ^b   Lee, K W ^b  

^a DEFENCE SCIENCE AND TECHNOLOGY LABORATORY   (United Kingdom)

^b IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0041787806     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420000044     Document Type: Article

References (8)

1. Yazadi N; Ayazi F, Najafi K (1998) Micromachined Inertial Sensors. Proc. IEEE-86: 1640-1659
2. McNie ME; King DO; Ward MCL; Blackstone S; Quinn C; Burdess J (1997) Deep reactive ion etching of SOI for silicon micromachined structures. Proc. IEEE Int. Conf. on SOI, IEEE-97CH36069: 60-61
3. Bharadwaj J; Ashraf H (1995) Advanced silicon etching using high density plasmas, Proc. Int. Sym. on Micromachining & Microfabrication, SPIE-2639: 224-233
4. King DO; Ward MCL; Brunson KM; Hamilton DJ (1998) Polysilicon process development for fully integrated surface micromachined accelerometer with CMOS electronics. Sensors and Actuators A68: 238-243
5. McNie ME; King DO (1998) CMOS compatibility of high aspect ratio micromachining (HARM) in bonded silicon-on-insulator (BSOI). Proc. Int. Sym. on Micromachining & Microfabrication, SPIE-3511: 277-287
6. McNie ME; Burdess JS; Harris AJ; Hedley J; Young M (1999) High aspect ratio ring gyroscopes fabricated in [100] silicon on insulator (SOI) material. Proc. Int. Conf. on Solid State Sensors and Actuators
7. Lee KW; Holmes AS (1999) Electrostatic actuation in electroformed Ni microstructures. Proc. Microengineering, Modelling & Design Seminar, IEE-99/052: 4/1-4/5
8. Burdess JS; Harris AJ; Langford R; Wood D; Ward MC; Williams G; Mcnie ME (1998) Issues associated with the design, fabrication and testing of a crystalline silicon ring gyroscope with electromagnetic actuation and sensing. IOP J Micromachining and Microengineering-8: 284-292