Modeling of interfacial delamination in plastic IC packages under hygrothermal loading

Journal of Electronic Packaging

Volumn 127, Issue 3, 2005, Pages 268-275

  Tay, Andrew A O ^a,b  

^a ASME   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK PROPAGATION; DELAMINATION; ELECTRIC LOADS; INTEGRATED CIRCUITS; INTERFACES (MATERIALS);

ENERGY RELEASE RATE; HYGROSTRESS; STRAIN ENERGY; TIME ALIGNMENT CONTROL;

ELECTRONICS PACKAGING;

EID: 26844522081     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1938209     Document Type: Article

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