Stability of J-integral calculation in the crack growth of copper/low-k stacked structures

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 885-891

  Lee, Chang Chun ^a   Chiu, Chien Chia ^a   Chiang, Kuo Ning ^a   Huang, Tai Chun ^b   Yao, Chih Hsiang ^b   Hsia, Chin Chiu ^b   Liang, Mong Song ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Copper low k structures; FEA; Interfacial crack; J integral

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTEGRATED CIRCUITS; THERMAL LOAD;

INTERFACIAL CRACK; J-INTEGRAL; LOW-K STRUCTURES; TEMPERATURE LOADS;

CRACK PROPAGATION;

EID: 33845594377     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645440     Document Type: Conference Paper

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